Registration Panel
2nd International Connect & Expo on Materials Science and Engineering
Event Serial-1808265
Website https://www.sciepublish.com/news/materialsconnect2026
Contact Person- conference coordinator
Event enquiries email address- office@sciepublish.org
Deadline for abstracts/proposals: 2026-04-15
Organized by: sciepublish
Venue: Osaka, Japan
About Event
2nd International Connect & Expo on Materials Science and Engineering, taking place from April 20–22, 2026, in Osaka, Japan. This premier event brings together leading researchers, industry professionals, and academic experts from around the globe to explore the latest innovations in materials science.
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